▣ Position: Post-doc
▣ Expected starting date period: as soon as possible
▣ Duration: 1 year (possible extension + 1 year)
▣ Deadline of this proposal : positions opened until filled
▣ RF-MEMS Packaging & RF SIP (System-In-Package)
▣ Summary of research/technical work :
The objective of the work of this position is the design, fabrication and characterization of zero-level package of RF(-MEMS) devices and silicon-based System-In-Package (SIP) at millimetre-wave frequency.
▣ The brief description of the work is in the following.
• We are developing to zero-level packaging technology for RF(-MEMS) device especially at millimetre-wave frequency application. For this purpose, the packaging technologies have been developed using BCB polymer due to its manufacturability and material properties friendly to high frequency application. The process improvement is going on for the packaging technologies of hard materials (silicon, glass) with BCB and of BCB thin-film itself.
•As the need for distributed sensors for many applications such as environment monitoring increases, multi-functional and multi-sensing systems with communication capability are strongly demanded. These kinds of sensor systems have to be packaged to protect themselves and to be assembled on a common platform, so called system-in-package (SIP). Recently, we are starting to develop a silicon-based SIP at 60 GHz band for the miniaturized RF system with antenna, filter and phase shifter etc.
▣ Required knowledge of candidate:
- Cleanroom experience
- Background in electromagnetics and technologies
- Knowledge of CAD and FEM software
- Characterization experience of the device
- Experience in fabrication of RF-MEMS devices will be appreciated
- Fluent english
▣ Location and other practical information:
IEMN, Villeneuve d’Ascq, France
▣ Contact(s):
Applications should include curriculum vitae with name, address (including e-mail)
and a list of publications. Applications should be sent to:
Seonho Seok, seonho.seok@iemn.univ-lille1.fr, http://www.iemn.univ-lille1.fr/
|
|||||||||||||||||||||||||||||||||||



